Disco corporation Equipment For Qrindinq Of

  • DISCO precision machines dicing-grinding service

    2021-11-17 · Best Equipment for advanced Dicing-Grinding Service. DISCO’s high-quality precision technology guarantees excellent processing results. Manufactured at the Kuwabata Plant in Hiroshima Prefecture, DISCO’s precision dicing saws and Grinding Solutions DISCO Corporation,Ultra-Thin Grinding In recent years, the demand for ultra-thin die for use in mobile phones, stacked packages, and a myriad of other applications has been increasing. DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions.

  • Dicing and Grinding Service Solutions DISCO Corporation

    Dicing and Grinding Service. This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE (Singapore), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA (Shanghai), DISO HI-TEC TAIWAN Thinning by Grinding Wheel (Grinding), DISCO Technology,Overview of Thinning by Grinding Wheel. Grinding is a process for making board-shaped workpieces thin (approx. less than 1 mm thick) and flat by using a grinding wheel. The grinding wheel is an abrasive which uses synthetic diamond. Wheel segments (thickness: several millimeters, height: 3 5 mm) are arranged along a ring-shaped wheel base.

  • DISCO grinding and polishing machines and abrasive

    2021-11-15 · DISCO HI-TEC EUROPE GmbH. Dicing-Grinding Service. Liebigstrasse 8 D-85551 Kirchheim b. München Germany. Phone +49 89 909 03-0 Fax +49 89 909 03-199. [email protected] Equipment List Support DISCO Corporation,2021-3-18 · Discontinued Machines List. The machines listed below are those which have been discontinued. DISCO defines seven years (84 months) from shipment of the machine as the warranty period for supply of spare parts.*. After this period, DISCO will continue to supply spare parts as long as circumstances permit. However, no warranties can be made

  • Product Information DISCO Corporation

    Product Information Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment.DISCO Corporation,DISCO術語辭典 精密加工工具(耗材) 各式資訊 Customer Equipment Improvement Information (CSMDC) 實用改善情報(技術面新消息) SDS 檢查表查詢 證明書/進出口法令判定書 已停產裝置資訊 文件 / 線上目錄 舊型機種使用說明書 刀痕檢測的訣竅

  • 减薄精加工研削 研削 解决方案 DISCO Corporation

    虽然通过采用Poligrind磨轮进行研削加工,可提高减薄精加工的加工质量。. 但由于使用的是磨轮,所以在晶片表面仍然会残留下细微的破碎层。. 为了去除表面残留的破碎层,进一步提高芯片的抗折强度,迪思科公司还可以根据客户的要求,提供各种不同的去除DISCO dicing saws and quality equipment dicing ,2021-11-15 · DISCO HI-TEC EUROPE GmbH. Dicing-Grinding Service. Liebigstrasse 8 D-85551 Kirchheim b. München Germany. Phone +49 89 909 03-0 Fax +49 89 909 03-199. [email protected]

  • Dicing and Grinding Using the Conventional Process (TGM

    Process Workflow 1: Processing by Each Equipment (Stand-Alone) (Each step is performed by stand-alone equipment) Protective tape (BG tape for backside grinding) is laminated onto the wafer surface’s circuit, the backside of the wafer is ground down to the designated thickness, and then the protective tape is removed from the wafer surface.Discontinued Equipment List Support DISCO Corporation,2021-3-18 · Discontinued Machines List. The machines listed below are those which have been discontinued. DISCO defines seven years (84 months) from shipment of the machine as the warranty period for supply of spare parts.*. After this period, DISCO will continue to supply spare parts as long as circumstances permit. However, no warranties can be made

  • Dicing-Grinding Service by DISCO dicing-grinding service

    2021-11-17 · Dicing-Grinding Service at DISCO EUROPE. DGS takes over any dicing/grinding/polishing task for semiconductor production as a supply chain partner for application support/improvement, prototype development or mass manufacturing. Using DISCO precision tools, we achieve highest quality, innovation and 100 % customer satisfaction.Disco Corporation Production Equipment Japan,Company profile for solar equipment manufacturer Disco Corporation showing the company's contact details and products manufactured. Disco Corporation 13-11 Omori-Kita 2-chome, Ota-ku, Tokyo 143-8580 Wafer Grinding Equipment, Wafer Polishing Machine Last Update 5 May 2021

  • Disco DAG810 Disco DAG810 Disco DAG810 AxusTech

    2021-8-4 · Disco DAG810 is a single axis automatic wafer grinder that can grind wafers up to 300mm diameter. With one air bearing grind spindle and one vacuum chuck mounted on a high precision mechanical lower spindle this grinder has a relatively small footprint of only 11 square feet.DISCO CORPORATION DFG840 WAFER GRINDER used, ,2021-11-1 · DISCO CORPORATION DFG840 WAFER GRINDER DISCO CORPORATION DFG840 WAFER GRINDER Pallet of Accessories Spindle Max Revolution 7, 000 min -1 17 KVA Air 0.5MPa (5kgf/cm2) Cutting Water 0.2 MPa 15/min Cooling Water 0.2MPa 11/min Mfg: Dec 1996

  • Disco DFG8540 AxusTech

    2021-8-4 · Disco DFG8540 system is a fully automatic in-feed surface grinder. With its conventional two-spindle, three-chuck design, the DFG8540 is capable of performing both large diameter grinding and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance.Manual for Old Equipment Support DISCO Corporation,Downloaded data may be viewed as often as you like. The variety of instruction manuals (models and types) will be increased in the future for customers who use and carefully maintain old equipment models. (Instruction manuals for the latest major models can be downloaded here ). For inquiry: [email protected] Login.

  • Dicing by Laser (Laser Dicing) DISCO Technology

    There are primarily two types of laser oscillation for processing: continuous wave (CW) oscillation and pulse oscillation. The pulse oscillation process can minimize the thermal effect and is mainly used for laser dicing in semiconductor manufacturing.Discontinued Equipment List Support DISCO Corporation,2021-3-18 · Discontinued Machines List. The machines listed below are those which have been discontinued. DISCO defines seven years (84 months) from shipment of the machine as the warranty period for supply of spare parts.*. After this period, DISCO will continue to supply spare parts as long as circumstances permit. However, no warranties can be made

  • Dicing-Grinding Service by DISCO dicing-grinding service

    2021-11-17 · Dicing-Grinding Service at DISCO EUROPE. DGS takes over any dicing/grinding/polishing task for semiconductor production as a supply chain partner for application support/improvement, prototype development or mass manufacturing. Using DISCO precision tools, we achieve highest quality, innovation and 100 % customer satisfaction.Disco Corporation Production Equipment Japan,Company profile for solar equipment manufacturer Disco Corporation showing the company's contact details and products manufactured. Disco Corporation 13-11 Omori-Kita 2-chome, Ota-ku, Tokyo 143-8580 Wafer Grinding Equipment, Wafer Polishing Machine Last Update 5 May 2021

  • Manual for Old Equipment Support DISCO Corporation

    Downloaded data may be viewed as often as you like. The variety of instruction manuals (models and types) will be increased in the future for customers who use and carefully maintain old equipment models. (Instruction manuals for the latest major models can be downloaded here ). For inquiry: [email protected] Login.Disco DAG810 Disco DAG810 Disco DAG810 AxusTech,2021-8-4 · Disco DAG810 is a single axis automatic wafer grinder that can grind wafers up to 300mm diameter. With one air bearing grind spindle and one vacuum chuck mounted on a high precision mechanical lower spindle this grinder has a relatively small footprint of only 11 square feet.

  • Disco DFG8540 AxusTech

    2021-8-4 · Disco DFG8540 system is a fully automatic in-feed surface grinder. With its conventional two-spindle, three-chuck design, the DFG8540 is capable of performing both large diameter grinding and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance.Dicing by Laser (Laser Dicing) DISCO Technology,There are primarily two types of laser oscillation for processing: continuous wave (CW) oscillation and pulse oscillation. The pulse oscillation process can minimize the thermal effect and is mainly used for laser dicing in semiconductor manufacturing.

  • DFG8540 Datasheet(PDF) 1 Page DISCO Corporation

    DFG8540/8560Fully Automatic In-Feed Surface GrinderAdvanced thinning power for large wafersGrinder of choiceThe DFG8540/8560 improves upon the functionality and performancethat made the DISCO 800 series the grinder of choice at facilitiesaround the world.Thin grinding (<100 µm)Advanced handling systems and design features facilitate high yield forthin wafer grinding. datasheet searchDicing Process using Blades (Blade Dicing) DISCO,Dicing is a process for cutting and making grooves using dicing blades. Dicing blades are abrasive blades that use synthetic diamond as the abrasive grit. The outer diameter of the dicing blade is approx. 50 mm and thickness is approx. 0.01 0.5 mm. There are various types of blades with different grit sizes, bond materials, and shapes.

  • Equipment for metallography Struers

    Grinding and Polishing Equipment. We have a full range of machines for mechanical preparation, from systems for occasional sampling to powerful solutions for high-volume processing. READ MORE. AbraPlan. A reliable high-capacity machine for efficient high-speed plane grinding, designed to save you time and consumables.,

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